- back
- Description
- Technical Specifications
- Hole Specifications
- Matching Products
- Processing
- Packaging
- Downloads
- Stock Check
MTCA Power Module Output Part No. 501-50096-183
Illustration similar
Perpendicular
Press-fit
Power
Rugged
- contacts: 72 signal, 24 power
- Press-fit
- according to PICMG specifications
Technical Specifications
Basics
| Specification | PICMG® MTCA.0 R1.0 |
|---|---|
| No. of Contacts | 96 (24 Power, 72 Signal) |
| Termination Technology | Press-fit |
| Termination Length | 3.5 mm |
| Operating Temperature Range | -55°C to +105°C |
Material
| Insulator Material | PBT glass filled, UL 94 V-0 |
|---|---|
| Contact Material | Copper alloy |
Mechanical
| Mating Force | max. 50 N |
|---|---|
| Separating Force | max. 50 N |
| Durability | 200 mating cycles |
Electrical
| Operational Current | Power contacts: max. 12 A, Signal contacts: max. 1 A |
|---|---|
| Insulation Resistance | ≥ 108 Ω |
| Test Voltage | 80 V r.m.s. |
Approval / Compliance
| UL file | E130314 |
|---|---|
| Environment | RoHS compliant |
Hole Specifications
| Material | imm. Sn printed circuit boards |
|---|---|
| Nominal Hole | Ø 0.6 mm |
| A PCB Thickness | min 1.44 mm |
| B Plated Hole | Ø 0.60 ±0.05 mm |
| C Drill Hole | 0.70 ±0.02 mm |
| D Cu Plating | min. 25 µm |
| E Surface | max. 1.5 µm; imm. Sn plating |
| F Annular Ring | min. 0.1 mm |
| Material | Ni, Au printed circuit boards |
|---|---|
| Nominal Hole | Ø 0.6 mm |
| A PCB Thickness | min 1.44 mm |
| B Plated Hole | Ø 0.60 ±0.05 mm |
| C Drill Hole | 0.70 ±0.02 mm |
| D Cu Plating | min. 25 µm |
| E Surface | Ni, Au plating, 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni |
| F Annular Ring | min. 0.1 mm |
Plated through-hole according to IEC 60352-5
Matching Products
Processing
Packaging
Tray
15 pcs / Tray
4 Tray / Box